| PART |
Description |
Maker |
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| CHF5KP30A CHF5KP50A CHF5KP110CA MSC0997 CHF5KP65A |
Patented Flip Chip Series
FLIP CHIP TVS DIODES
From old datasheet system
Transient Voltage Suppressor 瞬态电压抑制器
5000 W, BIDIRECTIONAL, SILICON, TVS DIODE FLIP CHIP-2
|
MICROSEMI[Microsemi Corporation]
Atmel, Corp.
Microsemi, Corp.
Vishay Intertechnology, Inc.
|
| CM1203 CM1203-01CP CM1203-01CS CM1203-02CP CM1203- |
1, 2 and 3-Channel ESD Arrays in CSP 1通道的ESD阵列的总警
1, 2 and 3-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard™ Coating (CSPESD301/302/303 pin compatible)
|
California Micro Devices Corporation
|
| MP1400GC |
7V Input, 0.6A Peak, 1.5MHz Negative DCDC Power Converter In 8-ball CSP Package
|
Monolithic Power System...
|
| LC0408FC3.3C07 LC0408FC36C LC0408FC05C LC0408FC08C |
200 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, DO-201 FLIP CHIP-8
200 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE ROHS COMPLIANT, FLIP CHIP-8
LOW CAPACITANCE FLIP CHIP ARRAY
|
PROTEC[Protek Devices]
|
| TC74HC240AFWI TC74HC241AFI TC74HC244AFI TC74HC244A |
OCTAL BUS BUFFER NON INVERTED, 3-STATE OUTPUTS
OCTAL BUS BUFFER INVERTED, 3-STATE OUTPUTS
Low Capacitance 8 Line EMI Filter with ESD Protection; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
8 Line EMI Filter with ESD Protection 1.6 x 4.0 mm DFN Package; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
Low Capacitance 8 Line EMI Filter with ESD Protection, 1.6 x 4.0 mm DFN Package ; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
4 Line EMI Filter with ESD Protection DFN 1.35 x 3.0 mm Package; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000
Low Capacitance 6 Line EMI Filter with ESD Protection; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000
10 Line EMI Filter; Package: Flip-Chip-25 CSP; No of Pins: 25; Container: Tape and Reel; Qty per Container: 3000
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 东芝的CMOS数字集成电路硅单
|
Toshiba Semiconductor
Toshiba Corporation
Toshiba, Corp.
|
| 5962-89841 PALCE22V10-15DMB PALCE22V10-10 PALCE22V |
3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 15 ns, CDFP24
Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 10 ns, CDIP24
Flash-erasable Reprogrammable CMOS PAL Device FLASH PLD, 10 ns, CDFP24
3.3V / 5V ECL Quad D Flip Flop with Set, Reset, and Differential Clock; Package: 32 LEAD LQFP 7x7, 0.8P; No of Pins: 32; Container: Tape and Reel; Qty per Container: 2000
3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: TSSOP 20 LEAD; No of Pins: 20; Container: Rail; Qty per Container: 75
3.3V / 5V ECL ÷2/4, ÷4/5/6 Clock Generation Chip; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
|
Ecliptek, Corp.
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
